ANALISIS MORFOLOGI DAN KOMPOSISI LAPISAN KOMPOSIT NI-ALN MENGGUNAKAN METODE ELEKTRODEPOSISI DENGAN RAPAT ARUS PULSA
Abstract
Abstrak
Pada penelitian ini telah dilakukan pendeposisian lapisan komposit Ni-AlN pada logam Tungsten Karbida (WC) dengan menggunakan rapat arus pulsa sebesar 0,4 mA/mm2. Pendeposisian lapisan komposit Ni-AlN dilakukan dengan metode elektrodeposisi selama 30 menit pada suhu 40ºC dengan laju pengadukan 600 rpm. Berdasarkan hasil karakterisasi SEM-EDS, lapisan komposit Ni-AlN dengan perbesaran 1000x menunjukkan bahwa adanya retakan pada permukaan substrat dan hanya merata pada beberapa bagian sehingga permukaan lapisan komposit Ni-AlN terlihat kasar. Hasil pemindaian EDS juga menunjukkan keberhasilan lapisan komposit Ni-AlN yang terbentuk dengan adanya kandungan logam Ni dan Al.
Kata-kata kunci: Elektrodeposisi, Kandungan Unsur, Morfologi, Komposit Ni-AlN, Rapat Arus Pulsa.
Abstract
In this study, Ni-AlN composite coatings have been deposited on Tungsten Carbide by using a pulse current density of 0,4 mA. The Ni-AlN composite coatings were carried out by using the electrodeposition method for 30 minutes at 40°C with a stirring rate of 600 rpm. The SEM-EDS characterization results confirmed that the Ni-AlN composite coatings with a magnification of 1000x show that there were cracks on the surface of the substrate and were only evenly distributed in some parts so that the Ni-AlN composite coatings exhibit rough surface morphology. The corresponding EDS scan also shows the Ni-AlN composite coatings formed in the presence of Ni and Al metals successfully.
Keywords: Electrodeposition, Element Content, Morphology, Ni-AlN Composite, Pulse Current Density.
References
K. Dahmani et al., “Environmental Cinnamon Extracts Effect on Electrodeposition of Copper in an Acidic Bath,” Portugaliae Electrochimica Acta, vol. 36, no. 2, pp. 119-131, 2018.
K. Yeti, N. Baiq Asma, Ahmadi, “Pengembangan Metode Elektrodeposisi,” Indonesian Chemistry and Application, 2549-2314, 2018.
S. Marwati, “Pengaruh Agen Pereduksi dalam Proses Elektrodeposisi terhadap Kualitas Deposit Cu dan Ag,” Jurnal Pendidikan Kimia Yogyakarta, pp. 1-5, 2013.
S. Senen, Rahmat, “Pengaruh arus dan waktu pada pelapisan nikel dengan elektroplating dengan bentuk plat,” vol. 6, no. 2, pp. 11-20, 2010.
R. R. Saputra et al., “Pengaruh Rapat Arus dan Waktu Pelapisan Nikel pada AISI 410 dengan Metode Pulse Electroplating Terhadap Struktur Mikro dan Laju Korosi,” Mater. Metal, pp. 77-82, 2017.
E. Budi et al., “Komposisi dan Morfologi Permukaan Lapisan Komposit Ni-TiAlN,” Prosiding Bidang Fisika, pp. 348-353, 2015.
K. Leli, B. Esmar, S. Iwan, Pengaruh Temperatur Terhadap Pembentukan Lapisan Komposit Ni-TiN/Si3N4 dengan Menggunakan Metode Elektrodeposisi,” Prosiding Seminar Nasional Fisika, 2019 .
C. Ma, W. Yu et al., “Jet pulse electrodeposition and characterization of Ni–AlN nanocoatings in presence of ultrasound,” Ceramics International, 2017.
W. Li, Y. Zhu, F. Xia, “Microstructure and erosion characteristics of Ni-AlN thin films prepared by electrodeposition,” Science and Engineering of Composite Materials, pp. 395-400, 2016.
F. Xia, Q. Li et al., “Preparation and characterization of Ni–AlN nanocoatings deposited by magnetic field assisted electrodeposition technique,” Ceramics International, 2019.
N. Grace, B. Esmar, S. Iwan, “Analisis Morfologi dan Komposisi Lapisan Komposit NI-ALN Dengan Metode Elektrodeposisi Menggunakan Scanning Electron Microscopy-Energy Dispersive Spectroscopy (SEM-EDS),” Prosiding Seminar Nasional Fisika, 2023.
S. Chen et al., “Effect of pulse current density on the microstructure of electrodeposited copper thin films,” Journal of Materials Science: Materials in Electronics, vol. 27, no. 2, pp. 1900-1905, 2016.
A. Elangovan, Y. Sasikumar, “Effect of pulse current density on morphology, hardness and corrosion resistance of pulse electrodeposited Ni-W alloy coatings,” Surface Engineering, vol. 35, no. 9, pp. 815-823, 2019.
J. I. Goldstein et al., “Scanning electron microscopy and X-ray microanalysis,” Springer, 2017.
R. F. Egerton, “Physical principles of electron microscopy: an introduction to TEM, SEM, and AEM,” Springer Science & Business Media, 2011.
J. I. Goldstein et al., “Scanning electron microscopy and X-ray microanalysis,” Springer, 2017.
R. F. Egerton, “Physical principles of electron microscopy: an introduction to TEM, SEM, and AEM,” Springer Science & Business Media, 2011.
